Description
Micron Technology is hiring a Director of Process Development in Advanced Packaging Technology Development to lead the development, qualification, and manufacturing transfer of scalable advanced packaging assembly processes for next-generation memory products. The role covers technology strategy, process innovation across 2.5D, 3DIC, hybrid bonding, HBM, and other packaging technologies, cross-functional and supplier partnerships, manufacturing readiness, yield and reliability improvement, and organizational leadership. Candidates need at least 12 years of semiconductor experience, including 5 years in advanced packaging technology development, 5 years managing managers or large technical organizations, relevant technical expertise, and an MS or Ph.D. in a related technical field.
