Director, IC Packaging Engineering – Mechanical Simulation at Qualcomm International Inc., Mexico Branch Office

Qualcomm is hiring a Director of Mechanical Simulation to lead a team of engineers delivering FEA-based mechanical simulation solutions for current and next-generation chipsets and advanced packaging technologies. The role oversees mechanical FEA modeling, warpage and solder joint reliability analysis, package assembly simulation, board-level reliability, chip-package-board interaction, simulation methodology, automation, and cross-functional stakeholder management. Candidates need a bachelor's, master's, or PhD in a relevant engineering field plus 6–8 years of system or package design/technology experience, with preferred qualifications including extensive IC packaging simulation experience, people management, and technical leadership.