Director of Packaging at cambridge-gan-devices

Cambridge GaN Devices is seeking a senior, hands-on Director of Packaging to lead the packaging function and develop advanced high-performance, high-density packaging solutions for GaN power semiconductors. The role covers package and module design, wafer back-end process modifications, supplier and assembly-house collaboration, multiphysics simulation, qualification and reliability testing, failure analysis, customer and applications-engineering support, and technology roadmap development. It is based in Cambridge, United Kingdom, with international travel and collaborative hybrid working within the UK and elsewhere in Europe and Asia.