Summary from listing
Amkor Technology is hiring a senior Director of Advanced Packaging and Wafer Services for its Tempe, Arizona office. The role provides strategic and technical leadership for advanced wafer-based IC package platforms, including HDFO, 2.5D, and chiplet architectures, while serving as a senior customer-facing leader for Tier 1 customers and coordinating with global R&D, engineering, operations, suppliers, and business development teams. Responsibilities include technology roadmaps, program execution, customer product management, technical tradeoffs, qualification, and production ramp. The position requires a bachelor's degree in engineering, at least 10 years of semiconductor packaging experience, and 10–20% domestic and international travel, with a hybrid schedule.
