Description
GlobalFoundries is hiring a Director of Advanced Packaging Development to lead the development and industrialization of advanced packaging solutions for silicon photonics and optical interconnect products. The role combines technical leadership of packaging architecture, assembly, qualification, reliability, manufacturing readiness, and cost optimization with roadmap strategy, customer and business engagement, OSAT and supplier partnership management, and cross-functional program execution. Candidates need a relevant advanced degree and at least 15 years of semiconductor packaging experience, including experience with OSATs, supply chains, and strategic customer engagements. The expected salary range is $166,500 to $290,000, with a possible U.S. Department of Defense security clearance requirement.
