Description
Micron Technology is hiring a Director of DRAM Packaging to lead the strategy, development, and execution of advanced packaging solutions across its memory portfolio. The role defines technology roadmaps, develops HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, and interconnect technologies; leads a global engineering organization; partners with design, manufacturing, quality, supply chain, and external partners; and drives technology investment, digital transformation, and organizational performance. The position requires a bachelor’s degree in a relevant technical field, at least 15 years of semiconductor packaging experience, and at least 10 years leading engineering teams or global organizations.
