Description
Micron is seeking an experienced organizational leader to lead advanced packaging process development for HBM, 3DS DRAM, and emerging 3D architectures. The role owns wafer-level and die-level process technologies from pathfinding through manufacturing readiness, develops novel process flows and materials, leads FOAK development and supplier engagement, guides complex cross-functional programs, and transfers technology to manufacturing. The position requires an MS in a relevant technical field, at least 15 years of semiconductor process development, manufacturing, or advanced packaging experience, and expertise in advanced packaging processes and integration. A PhD, advanced-memory or 3D-packaging experience, mentoring experience, and materials characterization or simulation experience are preferred. The role is part of Micron’s Technical Leadership Program and offers medical, dental, and vision plans.
