Description
Micron Technology is hiring a full-time Dry Etch Process Engineer at its Albany, New York site to develop, qualify, and sustain plasma dry-etch processes for next-generation memory devices. The role focuses on optimizing critical dimension control, etch profiles, selectivity, uniformity, and defect performance; reducing defects and improving yield; performing root-cause analysis; collaborating with equipment vendors and cross-functional teams; and supporting technology transfer to high-volume manufacturing. The position requires an M.S. or Ph.D. in a relevant engineering or technical field, semiconductor process development or sustaining engineering experience, plasma etch knowledge, and AI proficiency or AI-enabled ways of working. The US base salary range is $107,000 to $182,000 per year, with medical, dental, and vision plans available.
