Description
Experienced Electronics Engineer role on Arm’s Packaging, Boards and Multiphysics team focused on PCB and silicon packaging co-design for Arm processors, SoC integration, high-speed design, signal/power integrity, and collaboration with packaging, PCB fabrication, and engineering teams across geographies. The position supports early silicon and board architecture planning, develops physical hardware platforms for software development and validation, and requires proficiency with EDA tools such as Cadence OrCAD and Allegro. The role is hybrid and offers a salary range of $198,100 to $268,000 per year.
