Description
Arm is hiring an experienced Electronics Engineer to join its Packaging, Boards and Multiphysics team to help define and optimize PCB and silicon packaging co-design for next-generation hardware platforms. The role focuses on system-level hardware architecture for embedded compute platforms, collaborating with SoC, architecture, packaging, and platform teams to evaluate trade-offs across routability, signal and power integrity, manufacturability, cost, and performance. The position is hybrid, based at Arm, and offers a salary range of $249,900 to $338,100 per year.
