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Engineer – 3D NAND Process Integration at Micron

Department: STPG

Language
Setup
On-site
Location
Sgurgola, Lazio
Level
mid
Posted

Description

Micron Technology is hiring a NAND Module Process Integration Engineer in its Singapore R&D department. The role focuses on improving next-generation 3D NAND product yield and quality by designing and integrating process solutions, identifying technology gaps, developing CSPEC criteria, coordinating manufacturing experiments, supporting technology transfer and qualification, and leading yield and program reviews. The position requires semiconductor R&D experience, data analysis and process optimization skills, cross-functional collaboration, and a relevant engineering or material science degree.

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