Description
The role drives and qualifies new back-end technology bricks for advanced imaging-sensor packages, including optical modules and chip-scale packages, from early concept through high-volume production. It coordinates with Process R&D, manufacturing, suppliers, quality, planning, and business units; solves complex technical bottlenecks; assesses process changes and excursions; and supports gross-margin improvement, manufacturing performance, sustainability, and quality compliance. The position requires a bachelor’s or master’s degree in engineering or materials science, experience with CMOS image sensors or advanced packaging, industrialization experience, and technical analysis skills using JMP and MATLAB. Travel to Southeast Asia, Europe, and the United States may be required.
