The role involves semiconductor manufacturing processes including QFN-DP packaging, die attach, tape and reel, backgrind, and sawing, along with DOE, SPC, engineering tools, FMEA, control plans, and line sustaining. It requires an engineering background, at least five years of related experience, strong analysis and communication skills, and preferably project management experience; material science and reliability experience is advantageous. Travel time is 0–25%.
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