Description
Micron is hiring an early-career Engineer, Package–Silicon Integration to support NAND package and silicon integration for next-generation memory products. The role involves chip-package interaction assessments, package design and assembly investigations, DFMEA/PFMEA activities, yield and quality issue investigations, test vehicles and design-of-experiments support, technical documentation, and cross-functional collaboration with silicon, wafer fabrication, package design, assembly, R&D, and manufacturing teams. The position requires a bachelor’s or master’s degree in engineering and less than two years of relevant experience, with guidance and mentoring provided.
