Description
The Engineer, Reliability will develop reliability assessment strategies for new semiconductor package technologies, identify and mitigate failure risks, support qualification activities, execute stress tests and physical analyses, and evaluate chip-embedding packages and high-density power modules for AI applications. The role requires a bachelor's or master's degree in a relevant engineering or materials science field, at least one year of semiconductor manufacturing experience, and familiarity with reliability standards; experience with advanced packaging, statistical analysis, FMEA, Python, and Tableau is advantageous.
