Description
The role oversees back-end scan, pack, and automated optical inspection (AOI) unit processes in semiconductor manufacturing. Responsibilities include stabilizing production, reducing process variance, driving automation projects, investigating deviations and customer returns, managing risk, maintaining process documentation and standards, and supporting the qualification of new processes, equipment, and packaging materials. The position requires a bachelor’s degree in a relevant engineering or robotic systems field, 0–1 years of semiconductor industry experience, data-analysis and basic programming skills, and strong problem-solving, communication, and leadership abilities.
