Summary from listing
HSBC is hiring an Engineering Intern to work on digital products, software support, live projects, performance monitoring, and technical issue resolution. The role includes hands-on exposure to coding frameworks, programming languages, AI tools, software development, and operations, along with technical training and skills development. The internship is full time for 10 weeks beginning June 2027, requires a minimum GPA of 4.0/5.0 or 3.2/4.0, English fluency, graduation between November 2027 and July 2028, and legal permission to work in Hong Kong without visa sponsorship.
