Description
The role analyzes complex datasets related to EVG equipment, with a focus on overlay-related analyses for wafer bonding applications. Responsibilities include interpreting data, supporting customer and internal decision-making, coordinating on-site analyses, planning experiments, visualizing results, collaborating with engineering and product development teams, and developing new analysis methods. The position requires a university degree in data science or a related field, at least five years of documented advanced overlay-analysis experience, programming skills in Matlab and Python, statistical and mathematical modeling knowledge, and strong English skills. The stated annual gross salary is at least EUR 64,400.
