Summary from listing
AT&S is hiring an Expert R&D – Substrate & Packaging Industrialization professional in Leoben, Austria, to evaluate and transfer high-precision alignment integration approaches for components in substrate and packaging environments. The role assesses feasibility under realistic production conditions, develops and validates integration processes through prototyping and design of experiments, identifies tolerances and process sensitivities, and supports the definition of implementation pathways for new technologies. Candidates need a bachelor’s or master’s degree in a relevant technical field, at least five years of experience in substrate, PCB, or advanced packaging manufacturing or process development, and fluency in English.
