Description
The Failure Analysis Technician supports Failure Analysis Engineers with non-destructive verification, sample preparation, and physical analysis of semiconductor devices. The role uses optical and infrared microscopes, X-ray inspection, scanning acoustic microscopy, reballing, IC package reconditioning, decapsulation, mechanical polishing, ion milling, scanning electron microscopy, and focused ion beam cross-sectioning. Responsibilities include data analysis, technical reporting, tool administration, communication, teamwork, and working in a chemical laboratory. An associate degree or engineering-technician certification is preferred, along with 1–2 years of technician experience, IC failure analysis experience, Microsoft Office proficiency, and English business proficiency.
