Compensation · Listed in posting
$75,000 – $90,000/yr
Mycronic is hiring a Field Applications Service Engineer for its Die Bonding business line to provide remote and on-site technical support, repairs, installations, maintenance, troubleshooting, upgrades, and customer training for semiconductor back-end equipment. The role serves customers across the United States, Canada, and Mexico, requires frequent travel, and offers a base salary of $75,000 to $90,000 annually plus medical, dental, vision, retirement, and other benefits.
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electronics industryTäby, Sweden
Advanced production solutions for printed circuit board assembly, dispensing and chip protection in cellphones, medical, cars, etc. and world-leading laser writers for photomask for displays and semiconductors.