Description
Micron Technology is hiring a Thin Films Engineer to develop, optimize, and transfer deposition processes for EUV-enabled DRAM technology from early development through high-volume manufacturing. The role leads process characterization, troubleshooting, defect reduction, roadmap activities, and collaboration with internal teams and suppliers, while analyzing physical and electrical datasets. Candidates need a PhD or MS with at least four years of semiconductor materials or process development experience, along with expertise in thin-film physics, patterning films, and deposition processes such as ALD, CVD, PECVD, PE-ALD, and LPCVD. The full-time US base salary range is $107,000 to $182,000 per year, with medical, dental, and vision plans available.
