Description
The Flip Chip Process Engineer owns process development and technical support for silicon photonic chip wafers, including plasma cleaning, flux engineering, pick-and-place, reflow, underfill, curing, and TCB/NCP flux-less flow. The role characterizes process windows, optimizes integration with upstream bump and flip-chip processes, evaluates raw materials, conducts thermal and mechanical reliability testing, performs failure analysis, manages quality control and process variation, and supports SOPs, NPI, and engineering changes. Candidates need a bachelor's or master's degree in a relevant technical discipline and at least five years of hands-on flip-chip assembly experience.
