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FY27 Intern - MSIP Digital Design Engineering Internship - Canada (16 months) at Qualcomm International Inc., Mexico Branch Office

Department: Interim Engineering Intern - HW

Language

Compensation

CA$54,600 – CA$103,350/yr

Setup
On-site
Location
Toronto, Ontario
Type
Internship
Level
intern
Posted

Description

Qualcomm Canada ULC is hiring a Digital Design Engineering Intern to work on next-generation SerDes IP for high-performance computing and artificial intelligence applications. The intern will learn high-speed interconnect and SerDes design, implement modules in hardware design languages such as System Verilog, analyze test failures, improve design workflows, and collaborate across design verification, integration, systems, analog, firmware, physical design, and project management teams. The role is based in Toronto, Canada, with a 16-month internship from May/June 2027 through August/September 2028, and offers a pay range of $54,600 to $103,350 plus housing stipend, accrued vacation, and other benefits.

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