Description
The role provides technical leadership for yield, quality, reliability, productivity, and manufacturing excellence programs across OSAT sites. Responsibilities include OSAT site transfers, second-source and capacity-expansion qualifications, subcontractor change management, Safe Launch and PCN activities, root-cause investigations, supplier assessments, package documentation, and Smart Factory/AI/ML initiatives. The position requires a degree or MSc in a relevant engineering discipline, 8–10 years of semiconductor assembly and packaging experience, and expertise in advanced and mainstream packaging technologies, qualification, quality, reliability, and manufacturing improvement methods.
