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Haptic Module Process Engineer at Apple

Department: Hardware

Language
Location
Huangpu, Shanghai
Level
senior
Posted

Description

Apple’s ATG-Packaging group is seeking a Process Engineer to develop and deploy high-volume haptic or sensing modules. The role owns process design, materials, and equipment for an NPI module, collaborates with factory partners and cross-functional teams, develops sensor and actuator technologies, and leads the transition from process development through production ramp and high-volume manufacturing.

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