Hardware Manufacturing Engineer at Microsoft

Department: Manufacturing Engineering

Compensation

$102,100 – $202,200/yr

Setup: On-site
Location: Redmond, Washington · Mountain View, California
Type: Full-time
Level: mid
Posted: Sep 6, 2026

Description

Microsoft is hiring a Hardware Manufacturing Engineer to independently drive manufacturing workstreams for cloud hardware platforms, including GPU systems. The role covers product industrialization, NPI build execution, supplier and production readiness, manufacturing risk mitigation, process qualification, quality systems, root-cause analysis, yield and defect analytics, and operational improvement. Candidates need an engineering degree and at least one year of manufacturing or repair experience, with additional hardware manufacturing and NPI experience preferred. The typical U.S. base pay range is USD 102,100–202,200 per year, with higher ranges for the San Francisco Bay area and New York City metropolitan area.

Required Skills

DFM/DFA
NPI builds
Supplier qualification
PPAP
SPC
Yield analytics
Root cause analysis
PFMEA
PLM

Additional Information

Minimum Education: Master's degree in Manufacturing, Material, Mechanical, Electrical, Thermal, or Industrial Engineering, or a related field, with at least one year of manufacturing or repair experience; alternatively, a bachelor's degree with at least two years of manufacturing or repair experience or equivalent experience.
Required Previous Experiences: At least one year of experience in a manufacturing environment or repair.
Ability to meet Microsoft, customer, and/or government security screening requirements.
Preferred Qualifications: At least six years of experience in hardware manufacturing or new product introduction.
Experience executing hardware NPI builds, manufacturing process readiness, production ramp, or supplier qualification activities.
Experience using structured problem-solving methods and leading L1/L2 triage for hardware manufacturing issues.
Experience collaborating with cross-functional engineering teams and external manufacturing partners.
Experience in SoC system integration or advanced ASIC-based hardware programs.
Experience with server compute, storage, GPU or AI accelerator, networking, power-delivery, or high-speed interconnect product development or manufacturing.
Experience applying SPC, process capability analysis, control plans, yield analytics, or other statistical methods.
Experience with supplier qualification, PPAP, process audits, DFM/DFA, engineering-change impact assessment, and corrective-action closure.
Experience coordinating geographically distributed engineering and manufacturing teams and using PLM, change-control, project-tracking, and manufacturing execution systems.
Familiarity with Valor, Creo, Cadence Allegro, Power BI, or equivalent manufacturing, design-review, and data-visualization tools.

About Microsoft

Microsoft

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