Description
Micron Technology is hiring a SoC Physical Design Engineer in its Heterogeneous Integration Group to implement advanced HBM SoC logic and base-die designs from netlist through GDSII. The role owns physical implementation, timing closure, complex IP integration, physical signoff, DFT feasibility, manufacturability, tape-out support, and post-silicon debug, while collaborating with RTL, verification, packaging, assembly, test, and manufacturing teams. Candidates need strong SoC physical design experience, EDA tool proficiency, STA and power-integrity knowledge, and familiarity with physical verification; HBM or memory-subsystem experience and a relevant degree are preferred.
