Description
This role is a senior technical and business-development position focused on Advanced Packaging within electronic technology. The individual will define opportunities and ecosystem strategy, engage with partners and consortia, and drive development programs from idea through proof of concept for transfer into high-volume manufacturing. The job requires deep expertise in 300mm process/equipment R&D and packaging technologies such as wafer-level packaging, hybrid bonding, fusion bonding, deposition, CMP, bonding, and patterning, along with substantial external collaboration and cross-functional influence.
