Description
Amazon LEO is hiring an HW Development Engineer for its ASIC Team to design and own PCB schematics and layouts for test and software-development platforms that validate and bring up next-generation MODEM SoCs. The role collaborates with silicon, firmware, software, ASIC, mechanical, and post-silicon teams, addresses high-speed and mixed-signal interfaces, signal and power integrity, and manages boards through fabrication, assembly, bring-up, and ECO. Candidates need a bachelor's degree in electrical engineering or a related field, at least five years of multi-layer PCB design experience, Siemens Xpedition proficiency, and experience with DDR, SerDes, Ethernet, and PCB bring-up. The position is available in Austin, Texas, and Redmond, Washington, with a base salary of $136,000 to $184,000 annually.
