Description
Micron Technology is seeking a semiconductor package engineer to support package feasibility, architecture, design optimization, risk assessment, and qualification from concept through manufacturing readiness. The role covers mechanical, electrical, materials, thermal, and manufacturing fundamentals; CAD/EDA package design; design-for-manufacturing and reliability; and automation, AI/ML, and digital-engineering solutions. Candidates need a bachelor's or master's degree in a relevant engineering or data science discipline, engineering fundamentals, programming or scripting exposure, and strong collaboration and communication skills.
