Description
Apple is hiring an IC Packaging Engineering Lead to lead package integration and architecture, co-design packages with silicon, packaging, and systems teams, develop advanced packaging technologies, and drive solutions from concept through qualification and high-volume production. The role involves cross-functional collaboration with assembly partners and third-party or OSAT suppliers, technical documentation, design rules, risk assessment, and packaging reliability and manufacturing considerations. The position requires a bachelor's degree and 20+ years of relevant industry experience, with managerial skills and advanced packaging expertise preferred.
