Description
Amazon is hiring an IC Packaging Design Engineer to design and optimize packaging for mm-wave beamforming SoCs and front-end modules. The role involves defining floorplans, bump and ball maps, package layouts, stack-ups, materials, thermal and electromagnetic simulations, signal integrity, qualification, and AI-driven design workflows. Candidates need a bachelor's degree in electrical engineering or a related field, at least five years of RF design experience, and a proven track record of products reaching volume production. The position is based in San Diego, California, with a base salary of $136,000 to $184,000 annually.
