Description
Apple is hiring a senior IC packaging engineer to develop packaging technologies for new products, working with product, quality, supply chain, and external suppliers. The role covers packaging technology evaluation, package specification, advanced wafer bumping, wafer-level chip-scale packaging, FC-CSP, and SiP integration, proof-of-concept builds, qualification, reliability testing, yield analysis, supplier management, and packaging roadmap development. The position requires an M.S. or Ph.D. in a relevant discipline and at least five years of IC packaging experience, with 5–10% travel to domestic and international locations.
