Description
NVIDIA is hiring a Package Engineer in Israel to lead the development of advanced microelectronics packaging for its Networking Business Unit. The role involves collaborating with SI, layout, ASIC design, and vendor teams; evaluating product reliability and performance; reviewing manufacturability; supporting production excursions, failure analysis, and reliability; monitoring yield and production KPIs; and leading process-change reviews. Candidates need a BSc or equivalent in mechanical or materials engineering or related experience, at least two years of semiconductor packaging or equivalent development and manufacturing experience, design and DFM skills, and strong quality, leadership, and problem-solving abilities.
