Description
Apple is hiring an IC Packaging Engineering Lead to lead package integration and architecture, co-design packages with silicon, packaging, and systems teams, develop advanced packaging technologies, and drive solutions from concept through qualification and high-volume production. The role involves cross-functional collaboration with assembly partners and third-party or OSAT suppliers, with 5–10% travel. Minimum qualifications include a bachelor's degree and at least 10 years of relevant industry experience; an MS or PhD and 6+ years of experience are preferred.
