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IC Packaging Simulation Engineer at Apple

Department: Hardware

Language
Location
Chorrillos, Department of Lima · San Francisco, California
Level
senior
Posted

Description

The Packaging Simulation Engineer will perform numerical modeling of stress and deformation in component packages to understand chip-package and package-board interactions, support product yield and reliability, identify reliability risks during package definition, and assist with new product introduction and manufacturing issues. The role also involves scripting CAD/FEM software and using generative AI, machine learning, and numerical tools to create automated model-generation interfaces.

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