Description
Micron Technology is hiring a Process Integration Engineer for its 3D DRAM organization at a 300mm R&D facility. The role focuses on next-generation DRAM performance and manufacturability, including device components, process-flow optimization, cross-functional troubleshooting, experimental design, and analysis of inline, parametric, and probe data. Candidates must be current students who cannot graduate before September 2027, with a materials science and electrical engineering PhD preferred and a physics or chemical engineering PhD acceptable.
