Description
Micron Technology is hiring an ID1 High Volume Manufacturing Process Engineer Intern to support process optimization, yield improvement, cost reduction, and wafer output initiatives at its Boise semiconductor manufacturing site. The intern will collaborate with equipment and operations teams, resolve yield-impacting issues, apply SPC, FDC, and 8D methodologies, analyze process data, and develop procedures. The role requires a current engineering or related-degree student with a graduation date not before September 2027, knowledge of SPC and Design of Experiments, scripting or programming proficiency, and availability for 40 hours per week during Summer 2026 and 20 hours per week part-time during Fall 2026 and Spring 2027.
