Description
Micron Technology is hiring an ID1 High Volume Manufacturing Process Engineer Intern at its Boise site to support process optimization, yield improvement, cost reduction, and wafer output initiatives. The intern will collaborate with equipment and operations teams, resolve yield and output issues, apply SPC, FDC, and 8D methodologies, use AI-enabled tools and data analytics, and update engineering procedures. The role requires a current engineering or related-degree student, knowledge of SPC and Design of Experiments, scripting or programming proficiency, and a commitment of 40 hours per week during Summer 2026 and 20 hours per week part-time during Fall 2026 and Spring 2027.
