Description
Micron Technology is seeking a full-time Semiconductor Process Intern to study Poly-SiGe gap-fill performance in high-aspect-ratio structures. The intern will investigate deposition conditions, conformality, void formation, and pinch-off; identify process conditions that improve bottom-up fill; correlate fill quality with die strength and wafer or dice bending; and recommend an optimized process window and qualification plan. The role requires analytical and problem-solving skills, familiarity with machine learning, statistical analysis, AI-enabled workflows, semiconductor materials, thin-film deposition, process integration, or materials characterization, and Design of Experiments. The ideal candidate is pursuing an engineering or related degree and can commit to at least five months from January to June 2027.
