Description
ASM is hiring an Advanced Packaging R&D Intern to develop surface preparation solutions for hybrid bonding interconnect applications. The intern will define process specifications, perform process validation, design and analyze experiments, establish best-known methods, and present findings to support hybrid bonding process development. The role requires a bachelor’s, master’s, or equivalent degree in a relevant engineering or materials science field, semiconductor manufacturing interest, technical data analysis, teamwork, and problem-solving skills; semiconductor process knowledge, surface characterization experience, and strong data analysis are advantageous.
