Description
The Technical PhD Intern will support machining and lapping process development for next-generation wafer technologies. The role involves modeling and simulation, statistical and AI/ML analysis of process and equipment data, software and algorithm development, experimental design, process characterization, root-cause investigations, and collaboration with process, equipment, software, and data engineering teams. Candidates must be pursuing a PhD in a relevant engineering, materials, physics, or data science field, with the internship lasting at least four months and potentially on-site in Bangpa-in, Ayutthaya.
