Description
Micron Technology is hiring a Wafer Bonding Process Development Intern in Boise, Idaho to support research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices. The intern will plan and analyze experiments, evaluate bonding equipment, materials, and process solutions, improve yield, quality, cycle time, and manufacturing readiness, and use artificial intelligence and advanced analytics to accelerate process development. The role requires an MS or PhD candidate in a relevant technical field, semiconductor processing knowledge, research or project experience, and statistical and experimental-design skills.
