Department: BE
Infineon is hiring an Intern for Unit Process Development to support the die clip attach process through design-of-experiments (DOE) execution, data collection, and analysis. The role requires a bachelor's degree in engineering or a related field, a CGPA of 3.00 or above, at least three months of internship experience, analytical and communication skills, semiconductor-industry knowledge, and an interest in learning new technologies.
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semiconductor solutions10001+
Infineon Semiconductor & System Solutions - MCUs, sensors, automotive & power management ICs, memories, USB, Bluetooth, WiFi, LED drivers, radiation h