Description
The Lead Application Engineer supports circuit board encapsulant application development and customer field-service needs for a global adhesive technologies organization. The role translates customer requirements into technical solutions, develops and optimizes material and assembly processes, troubleshoots product and process issues, and provides on-site technical support to customers globally. It is split approximately 50% between laboratory/application engineering collaboration and 50% direct customer-facing support, with up to 25% international travel. The position requires a bachelor's or master's degree in engineering, materials science, or a related discipline, 7+ years of relevant experience, knowledge of circuit board encapsulants and SMT, and strong troubleshooting and customer-support skills.
