Description
The Lead Application Engineer supports board-level encapsulant application development and customer field-service needs, translating customer requirements into new applications and products. The role designs and administers internal screening evaluations, optimizes material-assembly processes, troubleshoots product and process issues, collaborates with global cross-functional teams, and provides on-site customer support as needed. It requires knowledge of circuit-board encapsulants, surface-mount technology, liquid application equipment, and customer engagement, with a bachelor’s or master’s degree and 7+ years of R&D or application-engineering experience, or a doctorate with 5+ years of experience. The position is full-time, pays $108,000–$140,000 annually, and requires occasional travel.
