Description
Applied Materials is hiring a full-time Field Service Engineer [Customer Engineer] in Nishi Tokyo, Japan, to install, maintain, and upgrade semiconductor packaging equipment for panel and wafer plating and sputtering applications. The role involves troubleshooting, preventive and corrective maintenance, customer communication, project coordination, and mentoring junior engineers. It requires a bachelor's degree, 7–10 years of experience in semiconductor or equipment support, advanced mechanical aptitude, semiconductor equipment knowledge, Japanese business-level proficiency, and the ability to meet on-site and clean-room requirements.
