Description
Quantum Motion is hiring a 3D Integration and Advanced Packaging Lead to build and lead a team developing complex multi-chip quantum modules using TSVs and microbumps for millikelvin quantum processors. The role covers packaging architecture, interconnect design, rapid prototyping, thermal cycling reliability, foundry and OSAT transfers, and coordination with design, process, cryogenic, and quantum hardware teams. Candidates need a master’s or PhD in a relevant field and at least seven years of 3D integration experience, along with team-management and external semiconductor-transfer experience.
