Description
Lockheed Martin is hiring a Lead Mechanical Engineer for its Advanced Electronics Packaging & Analysis group in the Sensor Mechanical Design Center. The role leads electro-mechanical packaging architectures and detailed designs for large-scale radars and airborne systems, coordinates multidisciplinary engineering efforts, drives trade studies, and oversees design reviews, supplier guidance, technical data packages, and laboratory and test activities. The position is based in Moorestown, New Jersey and requires a mechanical engineering degree, at least nine years of professional experience, electronics packaging expertise, and the ability to obtain and maintain a SECRET-level DoD clearance.
